IC-EPAE
The main purpose of International Conference on Electronics Packaging and Assembly Engineering is to bring industry professionals, experts, academicians, and scholars to discuss their expertise for better collaboration in the field.
Start Date
Tuesday, November 3, 2026
End Date
Wednesday, November 4, 2026
Registration Deadline
Monday, October 19, 2026
Submission Deadline
Wednesday, October 14, 2026
King's House Conference Centre
King's Church, Sidney Street, Manchester M1 7HB,
United Kingdom
Manchester, United Kingdom
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