ICTMEM
thermal management
electronics
microdevices
heat dissipation
thermal engineering
computational modeling
system optimization
energy efficiency
heat sinks
thermal analysis
microelectronics
energy systems
convective heat transfer
thermal systems
electronic cooling
Start Date
Monday, June 22, 2026
End Date
Tuesday, June 23, 2026
Registration Deadline
Sunday, June 7, 2026
Submission Deadline
Tuesday, June 2, 2026
Hotel Newv,
6 Seolleung-ro 85-gil,
Gangnam-gu, Seoul,
South Korea
Seoul, Soul-t ukpyolsi, South Korea
Dubai, United Arab Emirates
December-2026
Dubai, United Arab Emirates
December-2026
Dubai, United Arab Emirates
December-2026
Abu Dhabi, United Arab Emirates
December-2026
Seoul
December-2026
Seoul
December-2026
Seoul
December-2026
Seoul
December-2026
South Korea
December-2026
South Korea
December-2026
South Korea
December-2026
South Korea
December-2026
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